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KDS晶振,32.768K晶体,DST210AC晶振
32.768K系列产品本身具有体积小,厚度薄,重量轻等特点,此音叉型石英晶体谐振器,晶振产品本身具备优良的耐热性,耐环境特性,在办公自动化,家电领域,移动通信领域可发挥优良的电气特性,符合无铅标准,满足无铅焊接的回流温度曲线要求.更多 +
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西铁城晶振,圆柱晶振,CFS-206晶振
工作温度:-20℃~+70℃更多 +
保存温度:-40℃~+85℃
负载电容:12.5pF
32.768K时钟晶体具有小型,轻型的圆柱晶振表面音叉型晶体谐振器,产品具有优良的耐热性,耐环境特性,可发挥晶振优良的电气特性,符合RoHS规定.
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精工晶振,高端晶体,SC-32P晶振,Q-SC32P03220E6C5ADF晶振
二脚SMD金属面贴片晶振,表面金属封装,其实是属于压电石英晶振,是高可靠的环保性能,严格的频率分选,编带盘装,可应用于高速自动贴片机焊接,产品本身设计合理,成本和性能良好,产品被广泛应用于平板电脑,MP5,数码相机,USB接口最佳选择,包含RoHS指令豁免的密封玻璃中的铅.更多 +
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SEIKO晶振,石英晶体谐振器,SC-32A晶振
工作温度：-55°~125° 储存温度：-55°~125° 负载电容：12.5PF 贴片晶振本身体积小,超薄型石英晶体谐振器,特别适用于有目前高速发展的高端电子数码产品,因为晶振本身小型化需求的市场领域,广泛用于笔记本电脑,无线电话,卫星导航HDD, SSD, USB, Blu-ray等用途,符合无铅焊接的高温回流焊曲线特性更多 +
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精工晶振,贴片石英晶振,SC-12S晶振
1210mm体积的晶振,可以说是目前小型数码产品的福音,目前超小型的智能手机里面所应用的就是小型的石英晶振,该产品最适用于无线通讯系统,无线局域网更多 +
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SEIKO晶振,圆柱晶振,VT-120-F晶振
千赫频率元件,应用于时钟模块,智能手机,全球定位系统,因产品本身体积小,被广泛应用到各种小巧的便携式消费电子数码时间产品,儿童玩具等环保性能符合ROHS/无铅标准.更多 +
- [新闻中心]瑞萨晶振双核蓝牙低功耗SoC重塑物联网无线连接方案2026年09月03日 14:11
瑞萨晶振双核蓝牙低功耗SoC重塑物联网无线连接方案
瑞萨全新DA14592,DA14594系列BLESoC是行业内极具竞争力的双核低功耗蓝牙解决方案,搭载专属ArmCortex-M33高性能应用内核+Cortex-M0+超低功耗辅助内核的双核异构架构,打破传统单核心蓝牙芯片"高性能高功耗,低性能低算力"的两难困境,实现算力与功耗的极致平衡.其中M33主内核搭载浮点运算单元,可高效运行复杂的传感数据运算,算法处理,设备控制逻辑与自定义应用程序,满足中高端物联网终端的智能运算需求,轻量化M0+辅内核专注蓝牙协议栈运行,低功耗值守,简单任务调度,以纳瓦级超低功耗维持设备待机与无线链路监测.
双核心分工明确,独立运行,互不干扰,设备常规待机,蓝牙广播,链路值守等轻量任务由M0+内核承接,最大限度降低静态功耗,当设备需要数据采集,算法运算,高频通信时,快速唤醒M33主内核全速工作,任务完成后即刻回落超低功耗模式.相较于传统单核蓝牙SoC,该架构可直接降低30%以上的整体运行功耗,大幅延长纽扣电池,小型锂电池供电设备的续航周期,完美解决物联网终端续航短,频繁充电,更换电池成本高的行业痛点.- 阅读（66）
- [公司新闻]Rakon瑞康OCXO恒温晶振突破功耗与精度壁垒2026年08月06日 14:02
Rakon瑞康OCXO恒温晶振突破功耗与精度壁垒
传统恒温晶振(OCXO)凭借超高频率稳定度,极低老化率,优异相位噪声性能,一直是高精度时序同步的核心器件,但传统方案存在致命短板:功耗普遍高达1.5W～2W,发热量大,续航损耗高,完全无法适配电池供电的轻量化边缘终端.而常规TCXO温补晶振虽然功耗较低,却存在温漂偏大,保持精度不足,长期稳定性差的问题,无法满足边缘设备断星,离线状态下的高精度时序保持需求.针对行业"高精度与低功耗无法兼顾"的技术瓶颈,全球精密时序龙头品牌Rakon瑞康重磅迭代专为边缘设备定制的超低功耗OCXO系列产品,打破传统OCXO高功耗桎梏,以百毫瓦级超低功耗,Stratum3E级超高稳定精度,微型化封装,强环境适配能力,成为新一代高端边缘设备的最优精密时序解决方案.128587"],"1":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"2":["bold","true"]},"nextNum":3}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":true,"pasteRandomId":"91a9bff1-746c-4365-a3a0-fe3e77c40f55","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":3,"type":"text","selection":{"start":0,"end":324},"recordId":"Wym0fG2DldEOcxcPQyXceZ9Ln8f"}],"payloadMap":{},"isCut":false}'>- 阅读（82）
- [新闻中心]ECS-DCF系列陶瓷一体式带通滤波器2026年07月24日 15:54
ECS-DCF系列陶瓷一体式带通滤波器
针对Wi-Fi6/6E三频段路由器的射频抗干扰,信号净化,频段隔离核心刚需,美国ECS品牌依托数十年射频陶瓷元器件研发积淀,深耕无线通信滤波技术迭代,重磅推出ECS-DCF系列陶瓷一体式带通滤波器.该系列器件采用高端陶瓷一体烧结成型工艺,专为Wi-Fi三频段通信场景精准调校,具备超低插入损耗,超高带外抑制,精准选频特性,宽温稳定抗扰,微型集成化,高一致性量产六大核心优势,可完美适配2.4G/5G/6G全频段Wi-Fi6/6E路由器射频前端设计,精准过滤杂波干扰,隔离频段串扰,纯净信号频谱,充分释放Wi-Fi6/6E的高速传输,低延迟,多并发核心性能,是当前高端路由器,企业级AP,全屋组网设备射频优化的标杆级滤波解决方案.128587"],"2":["bold","true"]},"nextNum":3}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":false,"pasteRandomId":"18a309a7-eca4-437a-82fa-db1a2311451b","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":2,"type":"text","selection":{"start":520,"end":837},"recordId":"FUxMf2QQmdDUsAc6nIfczb2nnJd"}],"payloadMap":{},"isCut":false}'>- 阅读（86）
- [技术支持]SiTime晶振MEMS定时技术颠覆传统石英晶振壁垒2026年07月21日 09:27
SiTime晶振MEMS定时技术颠覆传统石英晶振壁垒
长久以来,移动电子产品普遍采用传统石英晶体振荡器作为定时核心,但其天然物理缺陷难以规避:石英晶片易碎,抗震抗摔性能弱,生产良率偏低;温度适应性差,高低温环境下频率漂移严重,容易导致设备卡顿,时序错乱;器件体积固定,集成度低,无法适配极致微型化设计;功耗控制有限,持续耗电影响设备续航.而SiTime深耕MEMS微机电定时技术多年,凭借全球领先的全硅MEMS半导体制造工艺,将微型谐振器,振荡电路,驱动模块高度集成于单芯片,彻底摆脱传统石英材质的工艺桎梏,成为替代传统晶振的新一代高端定时解决方案.
相较于传统石英晶振,SiTime的MEMS定时器件具备半导体级一致性,超高集成度,零碎频,低老化,参数可编程五大核心技术优势,完美适配移动设备高频使用,便携移动,环境多变,结构精密的应用特性,从底层硬件层面解决传统定时器件的各类痛点,为移动产品的性能优化与外观升级提供核心技术支撑,目前SiTime在全球MEMS时钟市场占有率稳居行业前列,技术认可度与产品可靠性经过全球终端厂商大规模量产验证.128587","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"OYMSd7XqHoAyzLxDZC5cIXdInZG","revisions":[],"text":{"initialAttributedTexts":{"text":{"0":"长久以来，移动电子产品普遍采用传统石英晶体振荡器作为定时核心，但其天然物理缺陷难以规避：石英晶片易碎、抗震抗摔性能弱，生产良率偏低；温度适应性差，高低温环境下频率漂移严重，容易导致设备卡顿、时序错乱；器件体积固定、集成度低，无法适配极致微型化设计；功耗控制有限，持续耗电影响设备续航。而SiTime深耕MEMS微机电定时技术多年，凭借全球领先的全硅MEMS半导体制造工艺，将微型谐振器、振荡电路、驱动模块高度集成于单芯片，彻底摆脱传统石英材质的工艺桎梏，成为替代传统晶振的新一代高端定时解决方案。"},"attribs":{"0":"*0*1+6w"}},"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"]},"nextNum":2}},"type":"text"}},"G9wTf0AZXdyaqWcYIcpcp7tKnwc":{"id":"G9wTf0AZXdyaqWcYIcpcp7tKnwc","snapshot":{"ai_extra":{"rewrite_command":1},"align":"left","author":"7592593332774128587","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"OYMSd7XqHoAyzLxDZC5cIXdInZG","revisions":[],"text":{"initialAttributedTexts":{"text":{"0":"相较于传统石英晶振，SiTime MEMS定时器件具备半导体级一致性、超高集成度、零碎频、低老化、参数可编程五大核心技术优势，完美适配移动设备高频使用、便携移动、环境多变、结构精密的应用特性，从底层硬件层面解决传统定时器件的各类痛点，为移动产品的性能优化与外观升级提供核心技术支撑，目前SiTime在全球MEMS时钟市场占有率稳居行业前列，技术认可度与产品可靠性经过全球终端厂商大规模量产验证。"},"attribs":{"0":"*0*1+r*0*1*2+r*0*1+3z"}},"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"],"2":["bold","true"]},"nextNum":3}},"type":"text"}},"OYMSd7XqHoAyzLxDZC5cIXdInZG":{"id":"OYMSd7XqHoAyzLxDZC5cIXdInZG","snapshot":{"type":"page","parent_id":"","comments":[],"revisions":[],"locked":false,"hidden":false,"author":"7592593332774128587","children":["YNxZfBZg9ddRPncreTtcUdtWnid","Jgc7fqPQ2dnhqJcBwWrc2RJsnph","O7XHf1tiZdtHQ1crikVcqP0Zn6f","G9wTf0AZXdyaqWcYIcpcp7tKnwc","JHU3fyA5LdQLiqcOxgccphLXnRb","R92ffzOoBdfprmc2WkFcuPgqnLb","Lz9OfYPdKdXXhTc9915cBDl8ntg","SfjRfNxiedhuSFc07jhcRmwZnad","ITc8fbtCbd9fEKcEZVHcHDFNnXd","XJGBfXuIsdaMAbc1y9ocY2mdnD2","GX86fyHJrdwxvPcHD0hc0Uvfnbc","Q250fqT7FdnAdjcoyRrcPqHznza","FPyPfnrTOdAXvGctPbdc2YLkn2c","CLoZfNMsxd4TZIcT0zVchLUnn5f","F75uf0qK9d3toqc1O6oc7pfpn7c","J4E9ffdQYdBxstc6pAlc9XbNnjb","Q8PzfotoMdZ45zcCqQhcFyqWnTd","GaZsfwDNMd7P5Qc9klscWju4nce","FnV3feXCudFyUvczLcPceisQnnf","O4lUf5BKnd0fs9cdsb6cyMqSn0b","VFNbfvimBdtB78c3Urfcfrhhnsg","KoYrfGQUZdZ5ROcupX7cjhjnngB"],"text":{"apool":{"nextNum":2,"numToAttrib":{"0":["author","7592593332774128587"],"1":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"]}},"initialAttributedTexts":{"attribs":{"0":"*0*1+13"},"text":{"0":"重塑移动产品体验！SiTime MEMS定时技术赋能设备性能与外观质感双重升级"}}},"align":"","doc_info":{"editors":["7592593332774128587"],"options":["editors","edit_time"],"deleted_editors":null,"option_modified":null},"revision_container_id":"doxcns2KZ7AUyT3RHrJ1CUVYCRh","status":{"streaming":{"enabled":false,"expired_at":"1784597122","is_create_command":true,"operator_id":"7592593332774128587","source":1}}}}},"payloadMap":{"O7XHf1tiZdtHQ1crikVcqP0Zn6f":{"level":1},"G9wTf0AZXdyaqWcYIcpcp7tKnwc":{"level":1}},"extra":{"channel":"saas","pasteRandomId":"e5a7b77f-74a9-442d-8329-276f2de47d6b","mention_page_title":{},"external_mention_url":{},"isEqualBlockSelection":true},"isKeepQuoteContainer":false,"selection":[{"id":4,"type":"text","selection":{"start":0,"end":248},"recordId":"O7XHf1tiZdtHQ1crikVcqP0Zn6f"},{"id":5,"type":"text","selection":{"start":0,"end":197},"recordId":"G9wTf0AZXdyaqWcYIcpcp7tKnwc"}],"pasteFlag":"3870542c-056b-48a5-a1ac-0e83c6498fff"}'>- 阅读（98）
- [技术支持]NDK晶振抗振动性能升级优化方案解析2026年07月13日 08:50
NDK晶振抗振动性能升级优化方案解析
NDK自研Low-G低加速度灵敏度技术是抗震性能升级的核心突破.通过应力仿真模拟分析振动应力分布规律,优化晶片切割角度与内部支撑结构,精准抵消振动带来的加速度干扰.相较于传统晶振,NDK全新抗震系列产品可将振动导致的性能衰减降低至原有产品的1/10,彻底解决常规晶振在持续振动下的相位噪声恶化,频率偏移问题,实现飞秒级超低抖动输出,完美适配高精度时钟,高速通信,精密测控等场景.128587"],"2":["bold","true"]},"nextNum":3}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":true,"pasteRandomId":"e1e6ea69-4311-4ec0-a1fa-2681435f0555","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":8,"type":"text","selection":{"start":0,"end":189},"recordId":"Mot4fcrHUdEL2ocFT7ncWl6anXh"}],"payloadMap":{},"isCut":false}'>- 阅读（96）
- [行业新闻]Microchip振荡器重磅迭代推出PIC64HX系列微处理器2026年07月03日 11:41
Microchip振荡器重磅迭代推出PIC64HX系列微处理器
作为全球嵌入式主控与精密时序领域的领军企业,Microchip深耕MCU/MPU芯片研发数十年,精准预判量子时代嵌入式设备的安全与算力刚需,依托自研芯片架构,硬件加密技术,精密时序校准积淀,全新推出PIC64HX系列64位高性能后量子安全微处理器.该系列芯片打破行业"算力强则功耗高,安全强则算力弱"的固有矛盾,采用全新64位高阶运算架构,搭载硬件级后量子加密安全引擎,智能能效管理系统,高稳定时序适配模块,实现极致算力输出,硬件原生抗量子破解,超低功耗运行,全链路安全防护四大核心突破,是目前行业内少有的兼顾高性能运算与后量子安全防护的标杆级嵌入式主控芯片.128587"],"2":["bold","true"]},"nextNum":3}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":true,"pasteRandomId":"40c7377f-fb2b-4287-a703-3314f312c6d3","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":8,"type":"text","selection":{"start":0,"end":280},"recordId":"SVI5fBKs0dh0ZrcLZ6EcqI3Rndb"}],"payloadMap":{},"isCut":false}'>- 阅读（74）
- [新闻中心]Transko重磅发布TFC/TFC5/TXJ高精度温补晶振新品2026年06月30日 14:30
Transko重磅发布TFC/TFC5/TXJ高精度温补晶振新品
Transko本次全新发布的TFC,TFC5,TXJ三大系列TCXO温补晶振,并非单一参数升级,而是基于行业全场景应用需求的体系化,差异化,全覆盖式产品迭代.三大系列分别在体积尺寸,温度精度,功耗参数,工况适配,性价比,量产属性上形成互补,依托Transko成熟的晶体精密加工工艺,自研智能温度补偿算法,低寄生电路架构与军工级品控体系,全面实现性能越级,对标进口同规格产品,可完美实现国产化替代,全方位满足不同行业,不同工况,不同精度,不同成本的选型需求.128587"]},"nextNum":2}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":true,"pasteRandomId":"0f2340d6-e6c1-414b-93ec-d8c80dda592c","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":7,"type":"text","selection":{"start":0,"end":228},"recordId":"Xo8XfilJSdeHW8cczNRctOQknog"}],"payloadMap":{},"isCut":false}'>- 阅读（81）
- [常见问题]River大河晶振AT切割与GT切割的具体差异2026年06月17日 09:12
- River大河晶振AT切割与GT切割的具体差异
在石英晶振制造行业中,晶片切割工艺是决定晶振核心性能的底层核心技术,也是区分晶振等级,适配场景,品质优劣的关键标准.很多电子工程师在设备调试,产品量产过程中遇到的时序漂移,信号不稳,高低温失效,计时偏差,设备频繁重启等疑难故障,溯源排查后绝大多数问题都源于晶振切割工艺选型不匹配.同一产地,同一材质的天然石英原石,经过不同角度,不同方式,不同工艺标准的切割打磨后,成型晶片的物理振动特性,应力结构,温变系数,老化速度会产生天壤之别,最终直接决定成品晶振的频率精度,温度稳定性,抗震抗扰性,使用寿命,深刻影响各类电子设备的时序运行与整机品质.在River大河晶振全系产品体系中,AT切割与GT切割是两大经典,应用最广泛的核心切割工艺,覆盖了从民用消费电子,智能家居,无线通信设备,到工业自动化控制,车载汽车电子,精密仪器仪表,物联网测控终端等全品类电子设备场景,是目前电子制造业最常用的两种晶体切割方案.128587","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"X6K1dFqH1oWPJbx0lQqcRyoOnvc","revisions":[],"text":{"initialAttributedTexts":{"text":{"0":"石英晶体的核心工作原理是压电效应，而切割角度直接决定晶片的振动模式、应力分布与物理特性，这也是AT切割与GT切割最根本的区别。"},"attribs":{"0":"*0*1+1r"}},"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"]},"nextNum":2}},"type":"text"}},"AxgRfDHH0dtCFDce8iEcZqRUn1d":{"id":"AxgRfDHH0dtCFDce8iEcZqRUn1d","snapshot":{"ai_extra":{"rewrite_command":1},"align":"left","author":"7592593332774128587","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"X6K1dFqH1oWPJbx0lQqcRyoOnvc","revisions":[],"text":{"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"],"2":["bold","true"]},"nextNum":3,"attribToNum":{"ai-extra,{\"is_ai_gen\":true,\"rewrite_command\":1}":0,"author,7592593332774128587":1,"bold,true":2}},"initialAttributedTexts":{"text":{"0":"1、River AT切割晶体（厚度剪切振动）"},"attribs":{"0":"*0*1*2+m"},"rows":{},"cols":{}}},"type":"text"}},"ZKslfSkF9dONzmcLrrbczXWHnQf":{"id":"ZKslfSkF9dONzmcLrrbczXWHnQf","snapshot":{"ai_extra":{"rewrite_command":1},"align":"left","author":"7592593332774128587","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"X6K1dFqH1oWPJbx0lQqcRyoOnvc","revisions":[],"text":{"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"],"2":["bold","true"]},"nextNum":3,"attribToNum":{"ai-extra,{\"is_ai_gen\":true,\"rewrite_command\":1}":0,"author,7592593332774128587":1,"bold,true":2}},"initialAttributedTexts":{"text":{"0":"AT切割是目前行业应用最普及、量产最成熟的石英晶体切割工艺。River大河晶振AT切割工艺采用精准的35°15′切割角度，依托石英晶体厚度剪切振动模式工作。简单来说，晶片通电后依靠本体厚度方向产生高频剪切振动，振动频率主要由晶片厚度决定，厚度越薄，输出频率越高。该切割工艺容错率低、加工精度高、量产稳定性极强，是River高频晶振、通用型工业晶振、消费电子晶振的主流工艺。"},"attribs":{"0":"*0*1+9*0*1*2+b*0*1+4m"},"rows":{},"cols":{}}},"type":"text"}},"EWQgfv5AYddWkdc9bxGcy4Xrnfc":{"id":"EWQgfv5AYddWkdc9bxGcy4Xrnfc","snapshot":{"ai_extra":{"rewrite_command":1},"align":"left","author":"7592593332774128587","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"X6K1dFqH1oWPJbx0lQqcRyoOnvc","revisions":[],"text":{"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"],"2":["bold","true"]},"nextNum":3,"attribToNum":{"ai-extra,{\"is_ai_gen\":true,\"rewrite_command\":1}":0,"author,7592593332774128587":1,"bold,true":2}},"initialAttributedTexts":{"text":{"0":"2、River GT切割晶体（面剪切振动）"},"attribs":{"0":"*0*1*2+l"},"rows":{},"cols":{}}},"type":"text"}},"FTE5fPbBddYRaRcOJR9cz9OunEe":{"id":"FTE5fPbBddYRaRcOJR9cz9OunEe","snapshot":{"ai_extra":{"rewrite_command":1},"align":"left","author":"7592593332774128587","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"X6K1dFqH1oWPJbx0lQqcRyoOnvc","revisions":[],"text":{"initialAttributedTexts":{"text":{"0":"GT切割属于经典的低频高精度切割工艺，采用专属特殊角度切割，依托石英晶体表面剪切振动模式运行。与AT切割厚度振动不同，GT切割晶体的振动频率由晶片的平面尺寸、长宽比例决定，不依赖晶片厚度。该工艺针对性优化低频工况特性，最大优势是低温漂、高稳定，是传统低频精密时序晶振的核心切割方案，River大河晶振高端低频精密型号多采用此工艺。"},"attribs":{"0":"*0*1+4l"}},"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"]},"nextNum":2}},"type":"text"}},"X6K1dFqH1oWPJbx0lQqcRyoOnvc":{"id":"X6K1dFqH1oWPJbx0lQqcRyoOnvc","snapshot":{"type":"page","parent_id":"","comments":[],"revisions":[],"locked":false,"hidden":false,"author":"7592593332774128587","children":["U4YxfL284dyRm4ctKc7cOXACnNg","QUcEfpVuvdU8X9cuunbcN6windf","TdnlfDPeKdRNuxcGUykcTyxsnwc","AqCCfVyjyd95oRc9cUccY8uqn0g","AxgRfDHH0dtCFDce8iEcZqRUn1d","ZKslfSkF9dONzmcLrrbczXWHnQf","EWQgfv5AYddWkdc9bxGcy4Xrnfc","FTE5fPbBddYRaRcOJR9cz9OunEe","Zq9afyVjodiGQJcCtApc6FXnnkh","LdzofXeBTdvVaMc1X8Xcxu8pn1b","Dq7DfnB1edxyOwcJMppc0wJCneh","AlLnfEqg1dDvu3cC6HMcUfclntB","OXqGf4JuhdDCkZcebcUcGIk1nyc","PP6Bf504qdDgi2cGMY3cHZNKnFh","QbSjf6qbjds51VcKPDbcSn0cnqQ","WZ4pf8ZaSdmHE9cAnowc89ZLnXg","YRsAfPkk7dF6COcl6uhcqEd9nDe","Stp9feyCpdAUXzcjpjSc5lz5n4e","Jwxpfn6QndROsVcXkR3cz6QXnOe","ElkgfwzB4dnqwWc0c3Jcyg6rnCe","Pi8hfW9CcdIJrTc8au4cUKyYn9b","OO9WfmrhJdC3woclPPBctINunzb","Xi4IfHy12d71JFcXzczcVBdwnUb","ZMQ8f8r6gdF54pcO4XHc6W2Nnib","XsYef6WbddG3jocYPY7cYe9bn2b","G2eAfYIQzdhHsmciECacYPU6nxe","UY2KfxtJAd7CGDcdS9zcW1jFnIe","IHjpfQ6ELdvjpzcKtE8cnIcjnuc","W9rjfMsQXdYDh5cdno3cv1yInIb","Q8srfNZdddN42rcH69TcH8Bknxc","PJ5Efke5qdwwQ4cxLkZcNUWHn5d","DzoUftgaadIBGucBs2Mcanj2njh","AguVfcpfddO0DocEz4VcBmuOnkN","IBUVfcdC0draY4cY8U8cvlIlnJb","HbbAfhgsjdJgEYc1aJtcHLBtn2c","FjWkfVSTzdacWGcPK0xcCFRFnHd","Myg5fXpuPdLd1bc4XqqcHkfRnbh","E6pAfYi6KduYJ0cLo2gc25kmnWh","D9v5f59ndd8nsCczflNc3Cs1nOd"],"text":{"apool":{"nextNum":2,"numToAttrib":{"0":["author","7592593332774128587"],"1":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"]}},"initialAttributedTexts":{"attribs":{"0":"*0*1+11"},"text":{"0":"硬核科普：River大河晶振AT切割晶体与GT切割晶体的核心区别与选型指南"}}},"align":"","doc_info":{"editors":["7592593332774128587"],"options":["editors","edit_time"],"deleted_editors":null,"option_modified":null},"revision_container_id":"doxcnInribDzteQ9UfelEkkkSOb","status":{"streaming":{"enabled":false,"expired_at":"1781658682","is_create_command":true,"operator_id":"7592593332774128587","source":1}}}}},"payloadMap":{"AqCCfVyjyd95oRc9cUccY8uqn0g":{"level":1},"AxgRfDHH0dtCFDce8iEcZqRUn1d":{"level":1},"ZKslfSkF9dONzmcLrrbczXWHnQf":{"level":1},"EWQgfv5AYddWkdc9bxGcy4Xrnfc":{"level":1},"FTE5fPbBddYRaRcOJR9cz9OunEe":{"level":1}},"extra":{"channel":"saas","pasteRandomId":"58773d8e-0baf-4e3c-979a-13a5ed9e970c","mention_page_title":{},"external_mention_url":{},"isEqualBlockSelection":true},"isKeepQuoteContainer":false,"selection":[{"id":5,"type":"text","selection":{"start":0,"end":63},"recordId":"AqCCfVyjyd95oRc9cUccY8uqn0g"},{"id":6,"type":"text","selection":{"start":0,"end":22},"recordId":"AxgRfDHH0dtCFDce8iEcZqRUn1d"},{"id":7,"type":"text","selection":{"start":0,"end":186},"recordId":"ZKslfSkF9dONzmcLrrbczXWHnQf"},{"id":8,"type":"text","selection":{"start":0,"end":21},"recordId":"EWQgfv5AYddWkdc9bxGcy4Xrnfc"},{"id":9,"type":"text","selection":{"start":0,"end":165},"recordId":"FTE5fPbBddYRaRcOJR9cz9OunEe"}],"pasteFlag":"ca236786-273a-462e-a221-8779b358918a"}'> 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TX7-705CM-SQ-HPG高性能晶振的机械耐受优势
作为国际知名高精度频率器件品牌,QuartzCom深耕高端晶振研发与制造多年,聚焦恶劣工况下的设备可靠性痛点,针对性推出TX7-705CM-SQ-HPG高可靠振荡器产品.该型号凭借独家加固结构设计,精密晶片封装工艺,极致的力学耐受性能,实现了行业顶尖的抗冲击,抗震动能力,完美适配各类高震动,高冲击,复杂动态工况,是工业,车载,户外,军工高可靠设备的优选时钟器件.128587"],"1":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"2":["bold","true"]},"nextNum":3}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":false,"pasteRandomId":"37e5f532-81f4-40da-ab75-6e346b074c88","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":3,"type":"text","selection":{"start":0,"end":182},"recordId":"Oup4fIgj1dooaRcYND9ce0oLnng"}],"payloadMap":{},"isCut":false}'>- 阅读（91）
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传统高端低噪器件又存在成本高昂,体积偏大,适配性有限,量产难度高的弊端,长期困扰高端通信设备厂商的产品迭代与品质升级.为彻底打破高端低噪时钟器件的性能与成本壁垒,填补中高端超低噪声VCXO市场空白,全球顶尖频率控制解决方案品牌Rakon瑞康,依托数十年高频低噪时钟研发积淀,独家高Q值晶体工艺与专属电路架构,重磅推出全新旗舰力作——RVX1490U超低相位噪声VCXO压控晶体振荡器.该产品凭借行业顶级超低相噪,极致低抖动,无次谐波,宽温高稳的硬核性能,成为5G通信,光传输,卫星地面通信,精密测控领域的标杆级低噪时钟方案.128587"],"2":["bold","true"]},"nextNum":3}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":false,"pasteRandomId":"5db0da9f-de0e-47cb-88be-1783c10c549d","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":3,"type":"text","selection":{"start":150,"end":412},"recordId":"GlbufzKEjd02bscSDBkcyZlanVf"}],"payloadMap":{},"isCut":false}'>- 阅读（78）
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Rakon全新38.4MHz高精度TCXO温补晶振,是品牌针对通信,工控,物联网,车载精密场景量身打造的工业级高性能有源时钟器件.产品依托Rakon数十年沉淀的晶体精密打磨工艺,成熟的智能温度补偿算法,低噪声电路优化架构与严苛的原厂品控体系,彻底突破传统通用晶振的性能上限,在频率精度,温稳控制,噪声抑制,功耗优化,环境适应性,批量一致性六大维度实现全方位升级,完美适配各类中高端精密通信设备的量产配套需求.128587"]},"nextNum":2}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":false,"pasteRandomId":"463d12b3-c701-49e1-b151-427447f25a30","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":7,"type":"text","selection":{"start":0,"end":203},"recordId":"OUzffZV5gdAqU0c4ss1cKgNBn41"}],"payloadMap":{},"isCut":false}'>- 阅读（116）
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MuRata村田SCL3400系列高精度数字双轴倾角传感器,专为工业设备姿态监测场景量身打造,核心优势集中体现在高精度测量,双轴同步监测,强抗干扰能力,超低功耗及广泛环境适应性,彻底解决了传统倾角传感器"精度不足,抗干扰弱,适配性差"的行业痛点,成为工业设备姿态监测的优选元器件.该系列传感器采用村田自主研发的高精度传感芯片与先进的信号处理算法,实现了双轴倾角的精准测量与实时数据输出,可广泛适配各类工业设备的姿态监测,角度控制,倾斜预警等应用场景,目前该系列核心型号包括SCL3400-D01,SCL3400-D02等,可满足不同工业场景的个性化监测需求.128587"]},"nextNum":2}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":true,"pasteRandomId":"bf97bd45-70b1-45d6-85fc-e0a42762950f","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":69,"type":"text","selection":{"start":0,"end":279},"recordId":"GIqRfmLoCdEfyCctIa1cOgGonwf"}],"payloadMap":{},"isCut":false}'>- 阅读（125）
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村田这款新一代LTE-M/NB-IoT模块的核心优势,在于全面支持蜂窝IoT专用LPWA多协议,完美兼容LTE-M(Cat-M1)与NB-IoT(Cat-NB2)双协议,同时向下兼容NB-IoTCat-NB1协议,可根据不同应用场景的网络环境与需求,自动切换适配的通信协议,实现"一模块适配多场景",彻底解决了传统模块"单协议适配性差""跨场景应用受限"的行业痛点,大幅提升了模块的应用灵活性与通用性.作为蜂窝IoT专用的LPWA模块,其深度契合LPWA技术低功耗,广覆盖,海量连接的核心需求,同时兼顾通信速率与成本控制,成为多场景蜂窝IoT应用的优选方案,目前该系列模块已正式量产,核心型号包括LBWA1ZZ1CD,LBWA1ZZ1DD等,可满足不同场景的个性化需求.128587"]},"nextNum":2}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":false,"pasteRandomId":"f995a858-3e1e-48aa-afda-6eec6fcf1853","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":34,"type":"text","selection":{"start":379,"end":589},"recordId":"Meb3fW0uWd3VFQc4l5ocl0Clnpb"}],"payloadMap":{},"isCut":false}'>128587"]},"nextNum":2}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":true,"pasteRandomId":"b3785826-1100-4914-8e86-54b858e086de","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":37,"type":"text","selection":{"start":0,"end":336},"recordId":"RaBCf7wGjdQFj6cwuk6c6KsPn5g"}],"payloadMap":{},"isCut":false}'>- 阅读（250）
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