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西铁城晶振,进口晶振,CM250C晶振
工作温度:-40℃~+85℃ 保存温度:-55℃~+125℃ 负载电容:12.5pF 贴片晶振本身体积小,超薄型石英晶体谐振器,特别适用于有目前高速发展的高端电子数码产品,因为晶振本身小型化需求的市场领域.更多 +
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西铁城晶振,无源晶振,CM200C晶振
工作温度:-40℃~+85℃ 保存温度:-55℃~+125℃ 负载电容:12.5pF 适用于宽温范围的电子数码产品,家电电器及MP3,MP4,播放器,单片机等领域.可对应8.000MHz以上的频率,在电子数码产品,以及家电相关电器领域里面发挥优良的电气特性,满足无铅焊接的回流温度曲线要求.更多 +
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西铁城晶振,贴片晶振,CM130晶振
工作温度:-40℃~+85℃ 保存温度:-55℃~+125℃ 负载电容:12.5pF 32.768K时钟晶体具有小型,薄型,轻型的贴片晶振表面音叉型晶体谐振器,产品具有优良的耐热性,耐环境特性,可发挥晶振优良的电气特性,符合RoHS规定.更多 +
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西铁城晶振,32.768K晶振,CFV-206晶振
工作温度:-20℃~+70℃更多 +
保存温度:-40℃~+85℃
负载电容:12.5pF
插件表晶32.768K系列具有超小型,质地轻的表面贴片音叉型石英晶体谐振器,金属外壳的石英晶振使得产品在封装时能发挥比陶瓷晶振外壳更好的耐冲击性能.
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KDS晶振,32.768K晶振,DST1210A晶振
32.768K系列产品本身具有体积小,厚度薄,重量轻等特点,此音叉型石英晶体谐振器,晶振产品本身具备优良的耐热性,耐环境特性,在办公自动化,家电领域,移动通信领域可发挥优良的电气特性,符合无铅标准,满足无铅焊接的回流温度曲线要求.更多 +
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KDS晶振,32.768K晶体,DST210AC晶振
32.768K系列产品本身具有体积小,厚度薄,重量轻等特点,此音叉型石英晶体谐振器,晶振产品本身具备优良的耐热性,耐环境特性,在办公自动化,家电领域,移动通信领域可发挥优良的电气特性,符合无铅标准,满足无铅焊接的回流温度曲线要求.更多 +
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西铁城晶振,圆柱晶振,CFS-206晶振
工作温度:-20℃~+70℃更多 +
保存温度:-40℃~+85℃
负载电容:12.5pF
32.768K时钟晶体具有小型,轻型的圆柱晶振表面音叉型晶体谐振器,产品具有优良的耐热性,耐环境特性,可发挥晶振优良的电气特性,符合RoHS规定.
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精工晶振,高端晶体,SC-32P晶振,Q-SC32P03220E6C5ADF晶振
二脚SMD金属面贴片晶振,表面金属封装,其实是属于压电石英晶振,是高可靠的环保性能,严格的频率分选,编带盘装,可应用于高速自动贴片机焊接,产品本身设计合理,成本和性能良好,产品被广泛应用于平板电脑,MP5,数码相机,USB接口最佳选择,包含RoHS指令豁免的密封玻璃中的铅.更多 +
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SEIKO晶振,石英晶体谐振器,SC-32A晶振
工作温度：-55°~125° 储存温度：-55°~125° 负载电容：12.5PF 贴片晶振本身体积小,超薄型石英晶体谐振器,特别适用于有目前高速发展的高端电子数码产品,因为晶振本身小型化需求的市场领域,广泛用于笔记本电脑,无线电话,卫星导航HDD, SSD, USB, Blu-ray等用途,符合无铅焊接的高温回流焊曲线特性更多 +
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精工晶振,贴片石英晶振,SC-12S晶振
1210mm体积的晶振,可以说是目前小型数码产品的福音,目前超小型的智能手机里面所应用的就是小型的石英晶振,该产品最适用于无线通讯系统,无线局域网更多 +
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SEIKO晶振,圆柱晶振,VT-120-F晶振
千赫频率元件,应用于时钟模块,智能手机,全球定位系统,因产品本身体积小,被广泛应用到各种小巧的便携式消费电子数码时间产品,儿童玩具等环保性能符合ROHS/无铅标准.更多 +
- [新闻中心]ECX-33AQ车规级石英晶振2026年09月30日 09:20
ECX-33AQ车规级石英晶振
ECX-33AQ是ECS品牌主打车规级应用的核心石英晶振型号,全系列严格遵循AEC-Q200汽车电子可靠性标准研发生产,从石英晶片选材,精密切割抛光,真空气密性封装,参数校准到高低温老化,振动冲击,湿热循环测试,全程按照车载严苛工况标准管控,彻底区别于普通民用消费级晶振,具备极强的环境耐受能力与运行稳定性.
产品采用行业经典3.2×2.5×0.95mm标准贴片封装,双焊盘极简设计,结构稳固,抗震抗摔,可完美抵御车辆行驶过程中的持续震动,颠簸冲击,不会出现器件脱焊,参数偏移,性能衰减等问题.工作温度覆盖-40℃~+125℃超宽温域,完美适配车载极寒,高温暴晒,机舱高温聚集等极端环境,杜绝普通晶振高低温下频率漂移过大,时钟失准,设备死机等故障,全方位保障车载电子设备全年稳定运行.
凭借硬核车规资质与优异的耐候性能,ECX-33AQ广泛适配各类车载核心设备,包括智能座舱控制系统,车载中控影音系统,ADAS辅助驾驶传感模块,车载蓝牙/车联网通信单元,车身控制模块BCM,车载定位导航终端,新能源汽车电控系统等,是目前汽车电子量产项目中性价比极高,稳定性极强的通用型车规晶振.12*0*1*2+h*0*1+2r"}},"apool":{"numtoattrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7672297316216213820"],"2":["bold","true"]},"nextnum":3}},"hidden":false,"author":"7672297316216213820","children":[],"align":"left","type":"text","parent_id":"edfwdtcuyoyxxvx961lcbgqx6ex","comments":[],"revisions":[]}},"wisjf7ewcdduuvckgarcyny3nrh":{"id":"wisjf7ewcdduuvckgarcyny3nrh","snapshot":{"ai_extra":{"rewrite_command":1},"align":"left","author":"7672297316216213820","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"edfwdtcuyoyxxvx961lcbgqx6ex","revisions":[],"text":{"apool":{"numtoattrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7672297316216213820"],"2":["bold","true"]},"nextnum":3,"attribtonum":{"ai-extra,{\"is_ai_gen\":true,\"rewrite_command\":1}":0,"author,7672297316216213820":1,"bold,true":2}},"initialattributedtexts":{"text":{"0":"产品采用行业经典3.2×2.5×0.95mm标准贴片封装，双焊盘极简设计，结构稳固、抗震抗摔，可完美抵御车辆行驶过程中的持续震动、颠簸冲击，不会出现器件脱焊、参数偏移、性能衰减等问题。工作温度覆盖-40℃~+125℃超宽温域，完美适配车载极寒、高温暴晒、机舱高温聚集等极端环境，杜绝普通晶振高低温下频率漂移过大、时钟失准、设备死机等故障，全方位保障车载电子设备全年稳定运行。"},"attribs":{"0":"*0*1+2q*0*1*2+e*0*1+23"},"rows":{},"cols":{}}},"type":"text"}},"n3mufmfkddb9lbcj6wlc66kkn3e":{"id":"n3mufmfkddb9lbcj6wlc66kkn3e","snapshot":{"ai_extra":{"rewrite_command":1},"align":"left","author":"7672297316216213820","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"edfwdtcuyoyxxvx961lcbgqx6ex","revisions":[],"text":{"initialattributedtexts":{"text":{"0":"凭借硬核车规资质与优异的耐候性能，ecx-33aq广泛适配各类车载核心设备，包括智能座舱控制系统、车载中控影音系统、adas辅助驾驶传感模块、车载蓝牙="" 车联网通信单元、车身控制模块bcm、车载定位导航终端、新能源汽车电控系统等，是目前汽车电子量产项目中性价比极高、稳定性极强的通用型车规晶振。"},"attribs":{"0":"*0*1+42"}},"apool":{"numtoattrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7672297316216213820"]},"nextnum":2}},"type":"text"}},"edfwdtcuyoyxxvx961lcbgqx6ex":{"id":"edfwdtcuyoyxxvx961lcbgqx6ex","snapshot":{"type":"page","parent_id":"","comments":[],"revisions":[],"locked":false,"hidden":false,"author":"7672297316216213820","children":["ucaxfgb48d0g5rchkfucokg5nhc","ucm8fhs34dfgpbcdqt8ce6yonbc","of0vfrbgqdojskc83zlc4jnpn2d","rkybfxzzadkjeici2hdcyap4nzh","wisjf7ewcdduuvckgarcyny3nrh","n3mufmfkddb9lbcj6wlc66kkn3e","v9lmfxoded8p27cpv7hcd8g1n67","mzukfcryfdmafycxzsgclobtntd","yn8cfsr3ddyrdvc6icnch4h8n5e","b9vqfld3jdzewfcnqkqc1yspndh","rvexfmmvidosdacsefvcvbaence","yalcfd5kddqvarc3lk6c7cd5n2e","nbp1flsv3dz6smcxt7ocx7mon7d","gbtufexuhd1jlhcbcytclvo6nwh","wkzjfs1hedptmzcdgmhczcgun3e","e2rtfm19ddrzw8ce0zicefojnnb","ymhwfw4mldirllcoxrgcjqefnrc","e9xhf37gfd93vycazlkcyzvxnph","eaz5fpyibdft4ucren7cp9denrc","lqldfdraydfz9xc1wcuct5cznxe","hkylfanlkd4begcwcdmc3paenev","xwx1foyqddnxa6cwb0eclycinue"],"text":{"apool":{"nextnum":2,"numtoattrib":{"0":["author","7672297316216213820"],"1":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"]}},"initialattributedtexts":{"attribs":{"0":"*0*1+z"},"text":{"0":"ecx-33aq车规级石英晶振｜专为汽车电子与物联网高可靠场景量身打造"}}},"align":"","doc_info":{"editors":["7672297316216213820"],"options":["editors","edit_time"],"deleted_editors":null,"option_modified":null},"revision_container_id":"doxc6srsoodaqedjxdip9brfawz","status":{"streaming":{"enabled":false,"expired_at":"1790731266","is_create_command":true,"operator_id":"7672297316216213820","source":1}}}}},"payloadmap":{"rkybfxzzadkjeici2hdcyap4nzh":{"level":1},"wisjf7ewcdduuvckgarcyny3nrh":{"level":1},"n3mufmfkddb9lbcj6wlc66kkn3e":{"level":1}},"extra":{"channel":"saas","pasterandomid":"b7788277-a3ec-4176-85c7-a82694a98994","mention_page_title":{},"external_mention_url":{},"isequalblockselection":true},"iskeepquotecontainer":false,"selection":[{"id":5,"type":"text","selection":{"start":0,"end":154},"recordid":"rkybfxzzadkjeici2hdcyap4nzh"},{"id":6,"type":"text","selection":{"start":0,"end":187},"recordid":"wisjf7ewcdduuvckgarcyny3nrh"},{"id":8,"type":"text","selection":{"start":0,"end":146},"recordid":"n3mufmfkddb9lbcj6wlc66kkn3e"}],"pasteflag":"d30cc961-f1a5-42ba-8ffa-da8195601b82"}"="" data-lark-record-format="docx/record" class="lark-record-clipboard" style="font-size:medium">- 阅读（34）
- [新闻中心]Pletronics普锐特UCG6系列温度补偿晶体振荡器2026年09月18日 11:59
Pletronics普锐特UCG6系列温度补偿晶体振荡器
Pletronics普锐特UCG6系列是一款高性能数字化温度补偿石英晶体振荡器(TCXO),隶属于Pletronics工业级高精度时序产品线,专为对频率稳定度,相位噪声,环境耐候性,长期可靠性有严苛要求的高端场景量身打造.区别于传统模拟温补晶振补偿精度有限,温区适配窄,参数一致性差的短板,UCG6系列搭载品牌自研数字化智能温度补偿架构,内置高精度温度传感单元,智能运算补偿芯片与优化型石英谐振模组,可实时采集环境温度变化,毫秒级动态校准频率偏移,精准修正石英晶体因温度变化产生的频率漂移,实现全温区范围内超高频率稳定度,彻底攻克传统晶振"温度一变,频率就飘"的行业痛点.128-07d3-4775-8bf6-d2f19153420e","mention_page_title":{},"external_mention_url":{}},"iskeepquotecontainer":false,"isfromcode":false,"selection":[{"id":4,"type":"text","selection":{"start":0,"end":286},"recordid":"uvnrfgwvvdchgacwgxechcjinic"}],"payloadmap":{},"iscut":false}"="" data-lark-record-format="docx/text" class="lark-record-clipboard" style="font-size:medium">- 阅读（54）
- [新闻中心]瑞萨晶振双核蓝牙低功耗SoC重塑物联网无线连接方案2026年09月03日 14:11
瑞萨晶振双核蓝牙低功耗SoC重塑物联网无线连接方案
瑞萨全新DA14592,DA14594系列BLESoC是行业内极具竞争力的双核低功耗蓝牙解决方案,搭载专属ArmCortex-M33高性能应用内核+Cortex-M0+超低功耗辅助内核的双核异构架构,打破传统单核心蓝牙芯片"高性能高功耗,低性能低算力"的两难困境,实现算力与功耗的极致平衡.其中M33主内核搭载浮点运算单元,可高效运行复杂的传感数据运算,算法处理,设备控制逻辑与自定义应用程序,满足中高端物联网终端的智能运算需求,轻量化M0+辅内核专注蓝牙协议栈运行,低功耗值守,简单任务调度,以纳瓦级超低功耗维持设备待机与无线链路监测.
双核心分工明确,独立运行,互不干扰,设备常规待机,蓝牙广播,链路值守等轻量任务由M0+内核承接,最大限度降低静态功耗,当设备需要数据采集,算法运算,高频通信时,快速唤醒M33主内核全速工作,任务完成后即刻回落超低功耗模式.相较于传统单核蓝牙SoC,该架构可直接降低30%以上的整体运行功耗,大幅延长纽扣电池,小型锂电池供电设备的续航周期,完美解决物联网终端续航短,频繁充电,更换电池成本高的行业痛点.- 阅读（77）
- [公司新闻]Rakon瑞康OCXO恒温晶振突破功耗与精度壁垒2026年08月06日 14:02
Rakon瑞康OCXO恒温晶振突破功耗与精度壁垒
传统恒温晶振(OCXO)凭借超高频率稳定度,极低老化率,优异相位噪声性能,一直是高精度时序同步的核心器件,但传统方案存在致命短板:功耗普遍高达1.5W～2W,发热量大,续航损耗高,完全无法适配电池供电的轻量化边缘终端.而常规TCXO温补晶振虽然功耗较低,却存在温漂偏大,保持精度不足,长期稳定性差的问题,无法满足边缘设备断星,离线状态下的高精度时序保持需求.针对行业"高精度与低功耗无法兼顾"的技术瓶颈,全球精密时序龙头品牌Rakon瑞康重磅迭代专为边缘设备定制的超低功耗OCXO系列产品,打破传统OCXO高功耗桎梏,以百毫瓦级超低功耗,Stratum3E级超高稳定精度,微型化封装,强环境适配能力,成为新一代高端边缘设备的最优精密时序解决方案.128587"],"1":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"2":["bold","true"]},"nextNum":3}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":true,"pasteRandomId":"91a9bff1-746c-4365-a3a0-fe3e77c40f55","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":3,"type":"text","selection":{"start":0,"end":324},"recordId":"Wym0fG2DldEOcxcPQyXceZ9Ln8f"}],"payloadMap":{},"isCut":false}'>- 阅读（108）
- [新闻中心]ECS-DCF系列陶瓷一体式带通滤波器2026年07月24日 15:54
ECS-DCF系列陶瓷一体式带通滤波器
针对Wi-Fi6/6E三频段路由器的射频抗干扰,信号净化,频段隔离核心刚需,美国ECS品牌依托数十年射频陶瓷元器件研发积淀,深耕无线通信滤波技术迭代,重磅推出ECS-DCF系列陶瓷一体式带通滤波器.该系列器件采用高端陶瓷一体烧结成型工艺,专为Wi-Fi三频段通信场景精准调校,具备超低插入损耗,超高带外抑制,精准选频特性,宽温稳定抗扰,微型集成化,高一致性量产六大核心优势,可完美适配2.4G/5G/6G全频段Wi-Fi6/6E路由器射频前端设计,精准过滤杂波干扰,隔离频段串扰,纯净信号频谱,充分释放Wi-Fi6/6E的高速传输,低延迟,多并发核心性能,是当前高端路由器,企业级AP,全屋组网设备射频优化的标杆级滤波解决方案.128587"],"2":["bold","true"]},"nextNum":3}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":false,"pasteRandomId":"18a309a7-eca4-437a-82fa-db1a2311451b","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":2,"type":"text","selection":{"start":520,"end":837},"recordId":"FUxMf2QQmdDUsAc6nIfczb2nnJd"}],"payloadMap":{},"isCut":false}'>- 阅读（93）
- [技术支持]SiTime晶振MEMS定时技术颠覆传统石英晶振壁垒2026年07月21日 09:27
SiTime晶振MEMS定时技术颠覆传统石英晶振壁垒
长久以来,移动电子产品普遍采用传统石英晶体振荡器作为定时核心,但其天然物理缺陷难以规避:石英晶片易碎,抗震抗摔性能弱,生产良率偏低;温度适应性差,高低温环境下频率漂移严重,容易导致设备卡顿,时序错乱;器件体积固定,集成度低,无法适配极致微型化设计;功耗控制有限,持续耗电影响设备续航.而SiTime深耕MEMS微机电定时技术多年,凭借全球领先的全硅MEMS半导体制造工艺,将微型谐振器,振荡电路,驱动模块高度集成于单芯片,彻底摆脱传统石英材质的工艺桎梏,成为替代传统晶振的新一代高端定时解决方案.
相较于传统石英晶振,SiTime的MEMS定时器件具备半导体级一致性,超高集成度,零碎频,低老化,参数可编程五大核心技术优势,完美适配移动设备高频使用,便携移动,环境多变,结构精密的应用特性,从底层硬件层面解决传统定时器件的各类痛点,为移动产品的性能优化与外观升级提供核心技术支撑,目前SiTime在全球MEMS时钟市场占有率稳居行业前列,技术认可度与产品可靠性经过全球终端厂商大规模量产验证.128587","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"OYMSd7XqHoAyzLxDZC5cIXdInZG","revisions":[],"text":{"initialAttributedTexts":{"text":{"0":"长久以来，移动电子产品普遍采用传统石英晶体振荡器作为定时核心，但其天然物理缺陷难以规避：石英晶片易碎、抗震抗摔性能弱，生产良率偏低；温度适应性差，高低温环境下频率漂移严重，容易导致设备卡顿、时序错乱；器件体积固定、集成度低，无法适配极致微型化设计；功耗控制有限，持续耗电影响设备续航。而SiTime深耕MEMS微机电定时技术多年，凭借全球领先的全硅MEMS半导体制造工艺，将微型谐振器、振荡电路、驱动模块高度集成于单芯片，彻底摆脱传统石英材质的工艺桎梏，成为替代传统晶振的新一代高端定时解决方案。"},"attribs":{"0":"*0*1+6w"}},"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"]},"nextNum":2}},"type":"text"}},"G9wTf0AZXdyaqWcYIcpcp7tKnwc":{"id":"G9wTf0AZXdyaqWcYIcpcp7tKnwc","snapshot":{"ai_extra":{"rewrite_command":1},"align":"left","author":"7592593332774128587","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"OYMSd7XqHoAyzLxDZC5cIXdInZG","revisions":[],"text":{"initialAttributedTexts":{"text":{"0":"相较于传统石英晶振，SiTime MEMS定时器件具备半导体级一致性、超高集成度、零碎频、低老化、参数可编程五大核心技术优势，完美适配移动设备高频使用、便携移动、环境多变、结构精密的应用特性，从底层硬件层面解决传统定时器件的各类痛点，为移动产品的性能优化与外观升级提供核心技术支撑，目前SiTime在全球MEMS时钟市场占有率稳居行业前列，技术认可度与产品可靠性经过全球终端厂商大规模量产验证。"},"attribs":{"0":"*0*1+r*0*1*2+r*0*1+3z"}},"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"],"2":["bold","true"]},"nextNum":3}},"type":"text"}},"OYMSd7XqHoAyzLxDZC5cIXdInZG":{"id":"OYMSd7XqHoAyzLxDZC5cIXdInZG","snapshot":{"type":"page","parent_id":"","comments":[],"revisions":[],"locked":false,"hidden":false,"author":"7592593332774128587","children":["YNxZfBZg9ddRPncreTtcUdtWnid","Jgc7fqPQ2dnhqJcBwWrc2RJsnph","O7XHf1tiZdtHQ1crikVcqP0Zn6f","G9wTf0AZXdyaqWcYIcpcp7tKnwc","JHU3fyA5LdQLiqcOxgccphLXnRb","R92ffzOoBdfprmc2WkFcuPgqnLb","Lz9OfYPdKdXXhTc9915cBDl8ntg","SfjRfNxiedhuSFc07jhcRmwZnad","ITc8fbtCbd9fEKcEZVHcHDFNnXd","XJGBfXuIsdaMAbc1y9ocY2mdnD2","GX86fyHJrdwxvPcHD0hc0Uvfnbc","Q250fqT7FdnAdjcoyRrcPqHznza","FPyPfnrTOdAXvGctPbdc2YLkn2c","CLoZfNMsxd4TZIcT0zVchLUnn5f","F75uf0qK9d3toqc1O6oc7pfpn7c","J4E9ffdQYdBxstc6pAlc9XbNnjb","Q8PzfotoMdZ45zcCqQhcFyqWnTd","GaZsfwDNMd7P5Qc9klscWju4nce","FnV3feXCudFyUvczLcPceisQnnf","O4lUf5BKnd0fs9cdsb6cyMqSn0b","VFNbfvimBdtB78c3Urfcfrhhnsg","KoYrfGQUZdZ5ROcupX7cjhjnngB"],"text":{"apool":{"nextNum":2,"numToAttrib":{"0":["author","7592593332774128587"],"1":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"]}},"initialAttributedTexts":{"attribs":{"0":"*0*1+13"},"text":{"0":"重塑移动产品体验！SiTime MEMS定时技术赋能设备性能与外观质感双重升级"}}},"align":"","doc_info":{"editors":["7592593332774128587"],"options":["editors","edit_time"],"deleted_editors":null,"option_modified":null},"revision_container_id":"doxcns2KZ7AUyT3RHrJ1CUVYCRh","status":{"streaming":{"enabled":false,"expired_at":"1784597122","is_create_command":true,"operator_id":"7592593332774128587","source":1}}}}},"payloadMap":{"O7XHf1tiZdtHQ1crikVcqP0Zn6f":{"level":1},"G9wTf0AZXdyaqWcYIcpcp7tKnwc":{"level":1}},"extra":{"channel":"saas","pasteRandomId":"e5a7b77f-74a9-442d-8329-276f2de47d6b","mention_page_title":{},"external_mention_url":{},"isEqualBlockSelection":true},"isKeepQuoteContainer":false,"selection":[{"id":4,"type":"text","selection":{"start":0,"end":248},"recordId":"O7XHf1tiZdtHQ1crikVcqP0Zn6f"},{"id":5,"type":"text","selection":{"start":0,"end":197},"recordId":"G9wTf0AZXdyaqWcYIcpcp7tKnwc"}],"pasteFlag":"3870542c-056b-48a5-a1ac-0e83c6498fff"}'>- 阅读（133）
- [技术支持]NDK晶振抗振动性能升级优化方案解析2026年07月13日 08:50
NDK晶振抗振动性能升级优化方案解析
NDK自研Low-G低加速度灵敏度技术是抗震性能升级的核心突破.通过应力仿真模拟分析振动应力分布规律,优化晶片切割角度与内部支撑结构,精准抵消振动带来的加速度干扰.相较于传统晶振,NDK全新抗震系列产品可将振动导致的性能衰减降低至原有产品的1/10,彻底解决常规晶振在持续振动下的相位噪声恶化,频率偏移问题,实现飞秒级超低抖动输出,完美适配高精度时钟,高速通信,精密测控等场景.128587"],"2":["bold","true"]},"nextNum":3}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":true,"pasteRandomId":"e1e6ea69-4311-4ec0-a1fa-2681435f0555","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":8,"type":"text","selection":{"start":0,"end":189},"recordId":"Mot4fcrHUdEL2ocFT7ncWl6anXh"}],"payloadMap":{},"isCut":false}'>- 阅读（114）
- [行业新闻]Microchip振荡器重磅迭代推出PIC64HX系列微处理器2026年07月03日 11:41
Microchip振荡器重磅迭代推出PIC64HX系列微处理器
作为全球嵌入式主控与精密时序领域的领军企业,Microchip深耕MCU/MPU芯片研发数十年,精准预判量子时代嵌入式设备的安全与算力刚需,依托自研芯片架构,硬件加密技术,精密时序校准积淀,全新推出PIC64HX系列64位高性能后量子安全微处理器.该系列芯片打破行业"算力强则功耗高,安全强则算力弱"的固有矛盾,采用全新64位高阶运算架构,搭载硬件级后量子加密安全引擎,智能能效管理系统,高稳定时序适配模块,实现极致算力输出,硬件原生抗量子破解,超低功耗运行,全链路安全防护四大核心突破,是目前行业内少有的兼顾高性能运算与后量子安全防护的标杆级嵌入式主控芯片.128587"],"2":["bold","true"]},"nextNum":3}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":true,"pasteRandomId":"40c7377f-fb2b-4287-a703-3314f312c6d3","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":8,"type":"text","selection":{"start":0,"end":280},"recordId":"SVI5fBKs0dh0ZrcLZ6EcqI3Rndb"}],"payloadMap":{},"isCut":false}'>- 阅读（99）
- [新闻中心]Transko重磅发布TFC/TFC5/TXJ高精度温补晶振新品2026年06月30日 14:30
Transko重磅发布TFC/TFC5/TXJ高精度温补晶振新品
Transko本次全新发布的TFC,TFC5,TXJ三大系列TCXO温补晶振,并非单一参数升级,而是基于行业全场景应用需求的体系化,差异化,全覆盖式产品迭代.三大系列分别在体积尺寸,温度精度,功耗参数,工况适配,性价比,量产属性上形成互补,依托Transko成熟的晶体精密加工工艺,自研智能温度补偿算法,低寄生电路架构与军工级品控体系,全面实现性能越级,对标进口同规格产品,可完美实现国产化替代,全方位满足不同行业,不同工况,不同精度,不同成本的选型需求.128587"]},"nextNum":2}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":true,"pasteRandomId":"0f2340d6-e6c1-414b-93ec-d8c80dda592c","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":7,"type":"text","selection":{"start":0,"end":228},"recordId":"Xo8XfilJSdeHW8cczNRctOQknog"}],"payloadMap":{},"isCut":false}'>- 阅读（99）
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