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KDS晶振,贴片晶振,DSB535SD晶振,有源进口晶振,1XTR25000VAA
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e=";font-family:宋体;font-size:14px">贴片晶振采用了多层、"1XTR25000VAA"多金属的溅射镀膜技术:是目前研发及生产高精度、高稳定性石英晶体元器必须攻克的关键技术之一。选用何镀材、镀几种材料、几种镀材的镀膜顺序,镀膜的工艺方法(如各镀材的功率设计等)。使用此镀膜方法使镀膜后的附着力增强,频率更加集中,那么如何把晶片能控制在e=";font-family:calibri;font-size:14px">1000ppme=";font-family:宋体;font-size:14px">之内呢。
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KDS晶振,贴片晶振,DSB221SDB晶振,SMD温补振荡器
更多 +e="text-indent:21px"> e=";font-family:宋体;font-size:14px">那么贴片晶振产品的点击又是怎么回事呢?产品的电极对于晶体来讲,主要是,改变频率,往外引出电极,改变阻抗,去掉杂波,贴片晶体的晶片有镀金镀银等区别,各项镀层也会对产品的频率发生一定的改变,因此电极的设计会使晶振的精度产生更高的要求。
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KDS晶振,贴片晶振,DSB321SDM晶振,26MHZ温补振荡器
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KDS晶振,贴片晶振,DSB221SDM晶振,2520温补振荡器
更多 +e="margin-top: 7px;margin-bottom: 10px;line-height: 18px"> e=";font-family:宋体;color:#333333;font-size:16px">高精度晶片的抛光技术:是目前晶片研磨技术中表面处理技术的最高技术,最终使晶片表面更光洁,平行度及平面度更好,降低谐振电阻,提高e=";font-family:helvetica;color:#333333;font-size:16px">Qe=";font-family:宋体;color:#333333;font-size:16px">值。从而达到一般研磨所达不到的产品性能,使石英晶体元器件的等效电阻等更接近理论值,使石英晶体元器件可在更低功耗下工作。使用先进的牛顿环及单色光的方法去检测晶片表面的状态
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KDS晶振,贴片晶振,DSA535SD晶振,8脚压控温补晶振
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KDS晶振,贴片晶振,DSA321SDM晶振,四脚压控温补晶振
更多 +e="text-indent:21px"> e=";font-family:宋体;font-size:14px">e="宋体">
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e="text-indent:21px"> e=";font-family:宋体;font-size:14px">那么贴片晶振产品的点击又是怎么回事呢?产品的电极对于晶体来讲,主要是,改变频率,往外引出电极,改变阻抗,去掉杂波,贴片晶体的晶片有镀金镀银等区别,各项镀层也会对产品的频率发生一定的改变,因此电极的设计会使晶振的精度产生更高的要求。
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KDS晶振,贴片晶振,DSA221SDM晶振,KDS压控温补晶振
更多 +e="text-indent:21px"> e=";font-family:宋体;font-size:14px">e="宋体">
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e="text-indent:21px"> e=";font-family:宋体;font-size:14px">那么贴片晶振产品的点击又是怎么回事呢?产品的电极对于晶体来讲,主要是,改变频率,往外引出电极,改变阻抗,去掉杂波,贴片晶体的晶片有镀金镀银等区别,各项镀层也会对产品的频率发生一定的改变,因此电极的设计会使晶振的精度产生更高的要求。
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KDS晶振,贴片晶振,DSA211SDM晶振,KDS压控温补晶振
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e="margin-top: 7px;margin-bottom: 10px;line-height: 18px"> e=";font-family:宋体;color:#333333;font-size:16px">高精度晶片的抛光技术:是目前晶片研磨技术中表面处理技术的最高技术,最终使晶片表面更光洁,平行度及平面度更好,降低谐振电阻,提高e=";font-family:helvetica;color:#333333;font-size:16px">Qe=";font-family:宋体;color:#333333;font-size:16px">值。从而达到一般研磨所达不到的产品性能,使石英晶体元器件的等效电阻等更接近理论值,使石英晶体元器件可在更低功耗下工作。使用先进的牛顿环及单色光的方法去检测晶片表面的状态
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KDS晶振,贴片晶振,DSB535SC晶振,WiMAX有源晶振
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KDS晶振,贴片晶振,DSB321SCB晶振,GPS晶振
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e=";font-family:宋体;color:#333333">e="宋体">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial"> e=";font-family:宋体;color:#333333">e="宋体">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial"> e=";font-family:宋体;font-size:14px">e="宋体">e="宋体">e="text-indent:28px"> e=";font-family:宋体;font-size:14px">e="宋体">石英晶体振荡器在设计时就与各款型号ICe="宋体">匹配等相关技术,使用e=";font-family:calibri;font-size:14px">ICe=";font-family:宋体;font-size:14px">与晶片设计匹配技术:是高频振荡器研发及生产过程必须要解决的技术难题。在设计过程中除了要考虑石英晶体谐振器具有的电性外,还有石英晶体振荡器的电极设计等有它的特殊性,必须考虑振荡器的供应电压、起动电压和产品上升时间、下降时间等相关参数。
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KDS晶振,贴片晶振,DSB221SCB晶振,2520温补晶振
更多 +e="text-indent:21px"> e=";font-family:宋体;font-size:14px">e="宋体">
e="text-indent:28px"> e=";font-family:宋体;color:#333333">e="宋体">
e=";font-family:宋体;font-size:14px">
e="text-indent:28px"> e=";font-family:宋体;font-size:14px">e="宋体">有源晶振,e="宋体">是只晶体本身起振需要外部电压供应e="Calibri">,e="宋体">起振后e=";font-family:calibri;font-size:14px">e="宋体">可直接驱动CMOS e="宋体">集成电路e=";font-family:宋体;font-size:14px">,e="宋体">产品本身e=";font-family:calibri;font-size:14px">e="宋体">已实现与薄型ICe="宋体">(e="Calibri">TSSOPe="宋体">封装e="Calibri">,TVSOPe="宋体">封装)同样的e="Calibri">1mme="宋体">厚度e=";font-family:宋体;font-size:14px">,e=";font-family:calibri;font-size:14px">e="宋体">断开时的消费电流是15 µAe="宋体">以下e=";font-family:宋体;font-size:14px">,e="宋体">编e=";font-family:calibri;font-size:14px">e="宋体">带包装方式可对应自动搭载及IRe="宋体">回流焊接(无铅对应)e=";font-family:宋体;font-size:14px">e="宋体">产品有几种电压供选1.8V,2.5V,3V3.3V,5V,e="宋体">以应对不同e="Calibri">ICe="宋体">产品需要e="Calibri">.e=";font-family:calibri;font-size:14px">.
e=";font-family:宋体;color:#333333">e="宋体">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial"> e=";font-family:宋体;font-size:14px">e="宋体">e="宋体">
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KDS晶振,贴片晶振,DSB321SCM晶振,无线温补晶振
更多 +e="text-indent:21px"> e=";font-family:宋体;font-size:14px">e="宋体">
e="text-indent:28px"> e=";font-family:宋体;color:#333333">e="宋体">
e="text-indent:28px"> e=";font-family:宋体;color:#333333">e="宋体">
e="text-indent:35px"> e=";font-family:calibri;font-size:14px">1.e=";font-family:宋体;font-size:14px">防止外界气体进入组件体内受到污染和增加应力的产生;e=";font-family:calibri;font-size:14px">2.e=";font-family:宋体;font-size:14px">使组件在真空下电阻减小;e=";font-family:calibri;font-size:14px">3.e=";font-family:宋体;font-size:14px">气密性高。此技术为研发及生产超小型、超薄型石英晶体元器必须攻克的关键技术之一。
e=";font-family:宋体;color:#333333">e="宋体">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial"> e=";font-family:宋体;color:#333333">e="宋体">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial"> e=";font-family:宋体;font-size:14px">e="宋体">e="宋体">
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KDS晶振,贴片晶振,DSB221SCM晶振,大真空温补晶振
更多 +e="text-indent:21px"> e=";font-family:宋体;font-size:14px">e="宋体">
e="text-indent:28px"> e=";font-family:宋体;color:#333333">e="宋体">
e=";font-family:宋体;font-size:14px">小体积有源石英晶体振荡器,在生产时需要在完全净化车间,在密封的机器设备中测良,封装等技术.
e=";font-family:宋体;color:#333333">e="宋体">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial"> e=";font-family:宋体;font-size:14px">e="宋体">e="宋体">
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KDS晶振,贴片晶振,DSA535SC晶振,无线网络基站用有源晶振
更多 +e="text-indent:21px"> e=";font-family:宋体;font-size:14px">e="宋体">
e="text-indent:28px"> e=";font-family:宋体;color:#333333">e="宋体">
e="text-indent:28px"> e=";font-family:宋体;color:#333333">e="宋体">
e=";font-family:宋体;font-size:14px">e="宋体">压控温补晶体系列,VC-TCXOe="宋体">产品内部晶片焊接模式采用了,高精密点胶技术:晶片胶点的位置、大小:位置准确度以及胶点大小一致性,通过图像识别及高精密度数字定位系统的运用、使晶片的点胶的精度在±e=";font-family:calibri;font-size:14px">0.02mme=";font-family:宋体;font-size:14px">之内。
e=";font-family:宋体;color:#333333">e="宋体">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial"> e=";font-family:宋体;color:#333333">e="宋体">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial">e="宋体">e="Arial"> e=";font-family:宋体;font-size:14px">e="宋体">e="宋体">
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KDS晶振,贴片晶振,DSA321SCM晶振,大真空VC-TCXO晶振
更多 +e="text-indent:21px"> e=";font-family:宋体;font-size:14px">e="宋体">
e="text-indent:28px"> e=";font-family:宋体;color:#333333">e="宋体">
e="text-indent:28px"> e=";font-family:宋体;color:#333333">e="宋体">石英振荡器,OSCe="宋体">应用:无线通信e="Arial">,e="宋体">智能手机e="Arial">,e="宋体">平板笔记本e="Arial">,e="宋体">计算机e="Arial">,e="宋体">全球e="Arial">GPSe="宋体">定位系统e="Arial">,e=";font-family:宋体;color:#333333;font-size:14px">WLANe="宋体">网络e=";font-family:宋体;color:#333333">e="宋体">产品等.VC-TCXOe="宋体">应用:智能手机晶体e="Arial">,e="宋体">无线基站e="Arial">,e="宋体">精密仪器e="Arial">,GPSe="宋体">卫星e="Arial">,e="宋体">汽车应用等晶体滤波器应用无线收发器e="Arial">,e="宋体">智能手机e="Arial">,e="宋体">无线网络发射e="Arial">,GPSe="宋体">全球定位等等e="Arial">.
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KDS晶振,贴片晶振,DSA221SCM晶振,大真空压控温补晶振
更多 +e="text-indent:21px"> e=";font-family:宋体;font-size:14px">e="宋体">
e="text-indent:28px"> e=";font-family:宋体;color:#333333">e="宋体">石英振荡器,OSCe="宋体">应用:无线通信e="Arial">,e="宋体">智能手机e="Arial">,e="宋体">平板笔记本e="Arial">,e="宋体">计算机e="Arial">,e="宋体">全球e="Arial">GPSe="宋体">定位系统e="Arial">,e=";font-family:宋体;color:#333333;font-size:14px">WLANe="宋体">网络e=";font-family:宋体;color:#333333">e="宋体">产品等.VC-TCXOe="宋体">应用:智能手机晶体e="Arial">,e="宋体">无线基站e="Arial">,e="宋体">精密仪器e="Arial">,GPSe="宋体">卫星e="Arial">,e="宋体">汽车应用等晶体滤波器应用无线收发器e="Arial">,e="宋体">智能手机e="Arial">,e="宋体">无线网络发射e="Arial">,GPSe="宋体">全球定位等等e="Arial">.
e=";font-family:宋体;font-size:14px">e="宋体">e="宋体">
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KDS晶振,贴片晶振,DSA211SCM晶振,移动电话晶振
更多 +e="text-indent:21px"> e=";font-family:宋体;font-size:14px">e="宋体">小尺寸的TCXOe="宋体">温补晶振内部晶片焊接模式采用了,高精密点胶技术,晶片胶点的位置、大小:位置准确度以及胶点大小一致性,通过图像识别及高精密度数字定位系统的运用、使晶片的点胶的精度在±e=";font-family:calibri;font-size:14px">0.02mme=";font-family:宋体;font-size:14px">e="宋体">之内,确保TCXOe="宋体">晶体产品精度,稳定性能良好发挥功能。
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KDS晶振,贴片晶振,DSS753SVD晶振,打印机用晶振
更多 +e="text-indent:28px"> e=";font-family:calibri;font-size:14px">1.e=";font-family:宋体;font-size:14px">防止外界气体进入组件体内受到污染和增加应力的产生;e=";font-family:calibri;font-size:14px">2.e=";font-family:宋体;font-size:14px">使组件在真空下电阻减小;e=";font-family:calibri;font-size:14px">3.e=";font-family:宋体;font-size:14px">气密性高。此技术为研发及生产超小型、超薄型石英晶体元器必须攻克的关键技术之一
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KDS晶振,贴片晶振,DSS753SVC晶振,扫描仪用晶振
更多 +e="宋体">贴片有源石英晶振是指在普通无源晶体上增加了电压,内部集成了相应ICe="宋体">与电容电阻,需要在净化万级车间生产,并且在密封机器设备中焊接加盖,内部封装模式是指在真空封装区域内进行封装。
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KDS晶振,贴片晶振,DSO1612AR晶振,小体积1612车载晶振
更多 +e="text-indent:21px"> e=";font-family:宋体;font-size:14px">e="宋体">小尺寸的TCXOe="宋体">温补晶振内部晶片焊接模式采用了,高精密点胶技术,晶片胶点的位置、大小:位置准确度以及胶点大小一致性,通过图像识别及高精密度数字定位系统的运用、使晶片的点胶的精度在±e=";font-family:calibri;font-size:14px">0.02mme=";font-family:宋体;font-size:14px">e="宋体">之内,确保TCXOe="宋体">晶体产品精度,稳定性能良好发挥功能。
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