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face="宋体">当国内企业随着生产成本的日益上涨，电子产品在选择使用晶体方面也从最初的日本进口品牌，慢慢的转向了台湾晶振品牌，或者国内本土品牌，比较畅销的台湾晶振品牌有【TXCface="宋体">】台湾精技，【HOSONIC】台湾鸿星【TAITIENface="宋体">】台湾泰艺【H.ELEface="宋体">】台湾加高【face="Arial">NSKface="宋体">】台湾津绽face="Arial">NSKface="宋体">晶振【SIWARD】台湾希华【Pericom】face="宋体">百利通亚陶晶振face="宋体">科技face="宋体">【CTSface="宋体">】美国face="Arial">CTSface="宋体">晶振

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face="宋体">日本进口贴片晶振品牌【EPSONface="宋体">】日本爱普生【face="Calibri">SEIKOface="宋体">】日本精工【face="Calibri">KDSface="宋体">】日本大真空【face="Calibri">CITIZENface="宋体">】日本西铁城【face="Calibri">RIVERface="宋体">】日本大河【kyoceraface="宋体">】日本京瓷32.768KHZface="宋体">系列，在当今全球晶振市场说的上是face="宋体">质优价廉，产品本身外观是多种化，体积有大有小，有二个脚SMDface="宋体">焊接模式，也有三个脚face="Calibri">SMDface="宋体">焊接模式face="Calibri">,face="宋体">一样有四个脚焊接模式，还有时钟模块焊接模式

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face="宋体">贴片石英晶体谐振器，又简称为排带包装，这是这产品采用排带盘式包装，使产品在焊接时能采用SMTface="宋体">自动贴片机高速的焊接，大大节约人工，提高工作效率。face="Helvetica">32.768KHzface="宋体">千赫子时钟晶体，其本身主要应用在时钟控制产品，或者是控制模块，主要给时钟芯片提供一个基准信号，其主要各项功能还得看应用何种产品。

face="宋体">小体积SMDface="宋体">时钟晶体谐振器face="Arial">,face="宋体">是贴片音叉晶体face="Arial">,face="宋体">千赫频率元件face="Arial">,face="宋体">应用于时钟模块face="Arial">,face="宋体">智能手机face="Arial">,face="宋体">全球定位系统face="Arial">,face="宋体">因产品本身体积小face="Arial">,SMDface="宋体">编带型face="Arial">,face="宋体">可应用于高性能自动贴片焊接face="Arial">,face="宋体">被广泛应用到各种小巧的便携式消费电子数码时间产品face="Arial">,face="宋体">环保性能符合face="Arial">ROHS/face="宋体">无铅标准face="Arial">.

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face="宋体">低频晶振face="宋体">可从7.98MHzface="宋体">起对应,face="宋体">小型,超face="宋体">薄型具备强防焊裂性,face="宋体">石英晶体face="宋体">在极端严酷的环境条件下也能发挥稳定的起振特性,face="宋体">产品本身face="宋体">具有耐热,face="宋体">耐振face="Helvetica">,face="宋体">耐撞击等优良的耐环境特性,face="宋体">满足无铅焊接以及高温face="宋体">回流温度曲线要求,face="宋体">符合AEC-Q200face="宋体">标准face="Helvetica">.

face="宋体">小体积SMDface="宋体">时钟晶体谐振器face="Arial">,face="宋体">是贴片音叉晶体face="Arial">,face="宋体">千赫频率元件face="Arial">,face="宋体">应用于时钟模块face="Arial">,face="宋体">智能手机face="Arial">,face="宋体">全球定位系统face="Arial">,face="宋体">因产品本身体积小face="Arial">,SMDface="宋体">编带型face="Arial">,face="宋体">可应用于高性能自动贴片焊接face="Arial">,face="宋体">被广泛应用到各种小巧的便携式消费电子数码时间产品face="Arial">,face="宋体">环保性能符合face="Arial">ROHS/face="宋体">无铅标准face="Arial">.

face="宋体">随着科技数码产品的小型化发展，晶体元件的尺寸也从最初的插件庞大体积演变成目前的多种规格SMDface="宋体">小尺寸趋势，目前晶体内部的石英晶片已经达到了face="Helvetica">+-0.002mmface="宋体">以内了，由于很多晶振厂家在生产小尺寸时所产生的问题，晶片很小导致晶体的各类寄生波(如长度伸缩振动，面切变振动)与主振动(厚度切变振动)的耦合加强

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face="宋体">低频晶振face="宋体">可从7.98MHzface="宋体">起对应,face="宋体">小型,超face="宋体">薄型具备强防焊裂性,face="宋体">石英晶体face="宋体">在极端严酷的环境条件下也能发挥稳定的起振特性,face="宋体">产品本身face="宋体">具有耐热,face="宋体">耐振face="Helvetica">,face="宋体">耐撞击等优良的耐环境特性,face="宋体">满足无铅焊接以及高温face="宋体">回流温度曲线要求,face="宋体">符合AEC-Q200face="宋体">标准face="Helvetica">.

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高精度晶片的抛光技术：是目前晶片研磨技术中表面处理技术的最高技术，最终使晶片表面更光洁，平行度及平面度更好，降低谐振电阻，提高Q值。从而达到一般研磨所达不到的产品性能，使石英晶体元器件的等效电阻等更接近理论值，使石英晶体元器件可在更低功耗下工作。使用先进的牛顿环及单色光的方法去检测晶片表面的状态

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face="宋体">温补晶振（TCXOface="宋体">）产品本身具有温度补偿作用face="Arial">,face="宋体">高低温度稳定性face="Arial">:face="宋体">频率精度高face="Arial">0.5 PPM?2.0 PPM,face="宋体">工作温度范围face="Arial">: - 30face="宋体">度?85face="宋体">度face="Arial">,face="宋体">电源电压face="Arial">:1.8V?3.3Vface="宋体">之间可供选择face="Arial">,face="宋体">产品本身具有温度电压控制功能face="Arial">,face="宋体">世界上最薄的晶振封装face="Arial">,face="宋体">频率face="Arial">:26face="宋体">兆赫face="Arial">,33.6face="宋体">兆赫face="Arial">,38.4face="宋体">兆赫face="Arial">,40face="宋体">兆赫face="Arial">,face="宋体">因产品性能稳定face="Arial">,face="宋体">精度高等优势face="Arial">,face="宋体">被广泛应用到一些比较高端的数码通讯产品领域face="Arial">,GPSface="宋体">全球定位系统face="Arial">,face="宋体">智能手机face="Arial">,WiMAXface="宋体">和蜂窝和无线通信等产品face="Arial">,face="宋体">符合face="Arial">RoHS/face="宋体">无铅face="Arial">.

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face="宋体">小型SMDface="宋体">有源晶振face="Arial">,face="宋体">从最初超大体积到现在的face="Arial">7050mm,6035mm,5032mm,3225mm,2520mmface="宋体">体积face="Arial">,face="宋体">有着翻天覆地的改变face="Arial">,face="宋体">体积的变小也试产品带来了更高的稳定性能face="Arial">,face="宋体">接缝密封石英晶体振荡器face="Arial">,face="宋体">精度高face="Arial">,face="宋体">覆盖频率范围宽的特点face="Arial">,SMDface="宋体">高速自动安装和高温回流焊设计face="Arial">,Optionableface="宋体">待机输出三态输出功能face="Arial">,face="宋体">电源电压范围：face="Arial">1.8V?5 V,face="宋体">高稳定性face="Arial">,face="宋体">低抖动face="Arial">,face="宋体">低功耗face="Arial">,face="宋体">主要应用领域face="Arial">:face="宋体">无线通讯face="Arial">,face="宋体">高端智能手机face="Arial">,face="宋体">平板笔记本face="Arial">WLAN,face="宋体">蓝牙face="Arial">,face="宋体">数码相机face="Arial">,DSLface="宋体">和其他face="Arial">ITface="宋体">产品的晶振应用face="Arial">,face="宋体">三态功能face="Arial">,PCface="宋体">和face="Arial">LCDMface="宋体">等高端数码领域face="Arial">,face="宋体">符合face="Arial">RoHS/face="宋体">无铅face="Arial">.

face="宋体">小体积face="Arial">SMDface="宋体">时钟晶体谐振器face="Arial">,face="宋体">是贴片音叉晶体face="Arial">,face="宋体">千赫频率元件face="Arial">,face="宋体">应用于时钟模块face="Arial">,face="宋体">智能手机face="Arial">,face="宋体">全球定位系统face="Arial">,face="宋体">因产品本身体积小face="Arial">,SMDface="宋体">编带型face="Arial">,face="宋体">可应用于高性能自动贴片焊接face="Arial">,face="宋体">被广泛应用到各种小巧的便携式消费电子数码时间产品face="Arial">,face="宋体">环保性能符合face="Arial">ROHS/face="宋体">无铅标准face="Arial">.

3225mmface="宋体">体积非常小的face="Arial">SMDcrystalface="宋体">器件face="Arial">,face="宋体">是民用小型无线数码产品的最佳选择face="Arial">,face="宋体">小体积的晶振被广泛应用到face="Arial">,face="宋体">手机蓝牙face="Arial">,GPSface="宋体">定位系统face="Arial">,face="宋体">无线通讯集face="Arial">,face="宋体">高精度和高频率的稳定性能face="Arial">,face="宋体">非常好的减少电磁干扰的影响face="Arial">,face="宋体">是民用无线数码产品最好的选择face="Arial">,face="宋体">符合face="Arial">RoHS/face="宋体">无铅face="Arial">.

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face="宋体">贴片石英晶体,face="宋体">体积小face="Helvetica">,face="宋体">焊接可采用自动贴片系统face="Helvetica">,face="宋体">产品本身face="宋体">小型,face="宋体">表面贴片晶振,face="宋体">特别适用于有小型化要求的电子数码产品face="宋体">市场领域,face="宋体">因产品face="宋体">小型,face="宋体">薄型face="宋体">优势,face="宋体">耐环境特性,face="宋体">包括耐高温,face="宋体">耐冲击性等,face="宋体">在移动通信领域face="宋体">得到了广泛的应用,face="宋体">晶振产品本身face="宋体">可发挥优良的电气特性,face="宋体">满足无铅焊接的高温face="宋体">回流温度曲线要求.

face="宋体">具有最适合于移动通信设备face="宋体">用途的高稳定的频率温度特性.face="宋体">为对应低电源电压的产品face="Helvetica">.(face="宋体">可对应face="Helvetica">DC +1.8 V±0.1 V to +3.2 V±0.1 V )face="宋体">高度：最高face="Helvetica">1.0 mm,face="宋体">体积：face="Helvetica">0.007 cm³,face="宋体">重量：face="Helvetica">0.024g,face="宋体">超小型face="Helvetica">,face="宋体">轻型face="Helvetica">.face="宋体">低消耗电流,face="宋体">表面贴片型产品.face="宋体">（可对应回流焊） 无铅产品face="Helvetica">.face="宋体">满足无铅焊接的回流温度曲线要求face="Helvetica">.

5032mmface="宋体">体积的石英晶体振荡器有源晶振face="Helvetica">,face="宋体">改产品face="宋体">可驱动2.5Vface="宋体">的face="宋体">温补晶振,face="宋体">压控晶振face="Helvetica">,VC-TCXOface="宋体">晶体振荡器face="宋体">产品,face="宋体">电源电压的低电耗型,face="宋体">编face="宋体">带包装方式,face="宋体">可对应自动face="宋体">高速贴片机自动焊接,face="宋体">及IRface="宋体">回流焊接（无铅对应）,face="宋体">为无铅产品,face="宋体">超小型,face="宋体">质地轻face="Helvetica">.face="宋体">产品被广泛应用到集成电路,face="宋体">程控交换系统face="Helvetica">,face="宋体">无线发射基站face="Helvetica">.